Circuit board architecture for an electronic device

ABSTRACT

An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

BACKGROUND

Electronic devices that include a circuit board and other components arewell known. Many electronic devices include multiple circuit boards thatare positioned inside a housing along with other components, such as abattery. For example, many mobile electronic devices, such as mobilephones, may include top and bottom circuit boards arranged at top andbottom locations within an electronic device housing, and a batterypositioned between the top and bottom boards. Various techniques havebeen employed to electrically connect the top and bottom boards, such asrouting a flexible circuit over a major surface of the battery betweenthe top and bottom boards or alongside the battery, and connecting thetop and bottom circuit boards via a printed circuit board in a C-shapedor side-board configuration.

SUMMARY

In general, this document describes devices, systems, and methodsrelated to circuit board configurations in electronic devices. Exampleelectronic devices may include first and second circuit boardspositioned within an electronic device housing and a third circuit boardconnecting the first and second circuit boards. The third circuit boardmay be oriented perpendicular to the first and second circuit boards.Such configurations can provide space savings that allow larger oradditional components to be accommodated within the electronic device,such as a larger battery having an improved power capacity.Alternatively or additionally, the overall size of the electronic devicemay be reduced.

As additional description to the embodiments described below, thepresent disclosure describes the following embodiments.

Embodiment 1 is an electronic device, comprising: an electronic devicehousing having a major planar face; a first circuit board and a secondcircuit board, the first circuit board and the second circuit board eachoriented parallel to the major planar face; a third circuit boardelectrically connected with the first circuit board and the secondcircuit board, at least a portion of the third circuit board orientedboth perpendicular to the major planar face and between the firstcircuit board and the second circuit board; and a battery at leastpartially surrounded by the first circuit board, the second circuitboard, and the third circuit board on at least three sides, wherein thefirst circuit board, the second circuit board, and the third circuitboard together extend along an entire length of the electronic devicehousing, and the first circuit board and the second circuit board eachextend across an entire width of the electronic device housing.

Embodiment 2 is the electronic device of embodiment 1, wherein the thirdcircuit board is integral to the first circuit board as a unitarycircuit board.

Embodiment 3 is the electronic device of embodiment 2, wherein the firstcircuit board, the second circuit board, and the third circuit board areintegrally formed as a unitary circuit board.

Embodiment 4 is the electronic device of any of the precedingembodiments, wherein the third circuit board is a printed circuit board.

Embodiment 5 is the electronic device of any of the precedingembodiments, wherein the third circuit board is a flexible circuit.

Embodiment 6 is the electronic device of any of the precedingembodiments, wherein the first circuit board and the second circuitboard are each fixedly positioned with respect to the electronic devicehousing and separated by a distance (d).

Embodiment 7 is the electronic device of embodiment 6, wherein the thirdcircuit board is oriented vertically over the entire distance (d).

Embodiment 8 is the electronic device of embodiment 6, wherein the thirdcircuit board is oriented vertically over at least half of the distance(d).

Embodiment 9 is the electronic device of embodiment 6, wherein the thirdcircuit board has a length (l_(board)) that is greater than the distance(d).

Embodiment 10 is the electronic device of any of the precedingembodiments, wherein the battery has first and second major facesseparated by sidewalls, and the first major face and the second majorface are oriented parallel to the first circuit board and the secondcircuit board.

Embodiment 11 is the electronic device of any of the precedingembodiments, wherein the electronic device housing includes first,second, third, and fourth outer sidewalls extending perpendicular fromthe major planar face, the electronic device having a length(L_(housing)) between the first outer sidewall and the second outersidewall of the electronic device housing.

Embodiment 12 is the electronic device of embodiment 11, wherein adistance between the first and second circuit boards is greater than0.5*length (Lhousing) of the electronic device housing.

Embodiment 13 is the electronic device of any of the precedingembodiments, wherein the third circuit board has a stiffness that isrelatively greater in a middle region and relatively lower at oppositeend regions.

Embodiment 14 is the electronic device of any of the precedingembodiments, wherein the third circuit board includes first and secondconnectors at opposite end regions connected to respective connectors ofthe first circuit board and the second circuit board.

Embodiment 15 is the electronic device of any of the precedingembodiments, wherein the first and second connectors each include atleast one board-to-board connector and at least one micro-coaxialconnector.

Embodiment 16 is an electronic device, comprising: an electronic devicehousing having a major planar face; a first printed circuit boardoriented parallel to the major planar face, the first printed circuitboard including a speaker, front facing camera, proximity sensor,microphone, and camera flash; a second printed circuit board orientedparallel to the major planar face and separated from the first printedcircuit board by a distance, the second printed circuit board includingan electrical connector, an audio connector, a microphone, and avibrator; a third printed circuit board electrically connected with thefirst and second circuit boards, at least a portion of the third circuitboard oriented both perpendicular to the major planar face and betweenthe first and second circuit boards; and a battery a least partiallysurrounded by the first circuit board, the second circuit board, and thethird circuit board on at least three sides; wherein the first circuitboard, the second circuit board, and the third circuit board togetherextend along an entire length (L_(housing)) of the electronic devicehousing, and the first circuit board and the second circuit board eachextend across an entire width (W_(housing)) of the electronic devicehousing.

Embodiment 17 is the electronic device of embodiment 16, wherein thethird circuit board is oriented perpendicular to the major planar faceover the entire distance.

Embodiment 18 is the electronic device of embodiments 16 or 17, whereinthe distance between the first and second circuit boards is greater than0.5*length (L_(housing)) of the electronic device housing.

Embodiment 19 is a method of manufacturing an electronic device,comprising: connecting a first circuit board and a second circuit boardwith a third circuit board, the third circuit board having major facesperpendicular to major faces of the first and second circuit boards;securing the first circuit board, the second circuit board, and thethird circuit board to an electronic device housing; positioning abattery in a space within the electronic device housing defined by thefirst circuit board, the second circuit board, and the third circuitboard.

Embodiment 20 is the method of embodiment 19, wherein the connectingstep comprises connecting at least one board-to-board connector and atleast one micro-coaxial connector.

These and other embodiments described herein may provide one or more ofthe following benefits. First, some configurations described hereinallow an electronic device to be smaller. Arranging a third circuitboard perpendicular to first and second boards that it connects betweencan facilitate positioning of larger or additional components within theelectronic device housing. For example, a circuit board configurationhaving circuit boards arranged perpendicular to one another canfacilitate positioning of relatively large components, such as abattery, within the electronic device housing in a space-efficientmanner.

Second, circuit board arrangements described herein, such as circuitboards arranged parallel to a thickness of an electronic device, canprovide flexibility in arranging and assembling other components withinthe electronic device. For example, a circuit board arrangement parallelto a thickness of an electronic device can provide robust connectionwith a user input (e.g. button, switch, etc.) on a sidewall of theelectronic device housing, and/or facilitate positioning of larger oradditional components within the electronic device housing.

Third, circuit board arrangements described herein can improve theusable time of an electronic device between charges by accommodating abattery having a larger volume. For example, orienting a circuit boardperpendicular to a major face of the battery may allow the battery tohave a relatively larger width and a higher power capacity than if thecircuit board were parallel to the major face of the battery.

Fourth, circuit board arrangements described herein may increaseflexibility in manufacturing and assembly of an electronic device. Forexample, first, second, and third circuit boards can be assembled witheach other and other components of the electronic device in a desiredsequence. An independent third circuit board may be connected with firstand second circuit boards before or after the first and second circuitboards are positioned within the electronic device housing.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features and advantages willbe apparent from the description and drawings, and from the claims.

DESCRIPTION OF THE DRAWINGS

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below, and wherein:

FIG. 1 is a perspective exploded view of an electronic device havingfirst and second circuit boards connected by a third circuit board.

FIG. 2 is a front view of the electronic device of FIG. 1.

FIG. 3 is a cross-sectional perspective view of the electronic device ofFIG. 1.

FIG. 4 is a perspective exploded view of another circuit board havingfirst, second, and third circuit boards.

FIG. 5 is a perspective exploded view of another circuit board havingfirst, second, and third circuit boards.

FIG. 6 is a plan view of an electrical connector.

FIG. 7 is a flow diagram of a method of manufacturing an electronicdevice.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

Referring to FIG. 1, an example electronic device 100 is shown,including an electronic device housing 110, battery 120, circuit board130 and a display assembly 140. Circuit board 130 includes first,second, and third circuit boards 130 a, 130 b, 130 c, that electricallyconnect various components of electronic device 100. First and secondcircuit boards 130 a, 130 b, are connected with third circuit board 130c, which is oriented perpendicular (e.g., substantially perpendicularwithin 10° of exactly perpendicular) to first and/or second circuitboards 130 a, 130 b, in some embodiments. Third circuit board 130 celectrically connects first and second circuit boards 130 a, 130 b in aspace-efficient manner such that larger or additional components can beaccommodated within electronic device housing 110 with first, second,and/or third circuit boards 130 a, 130 b, 130 c than if other circuitboard architectures were employed.

Electronic device 100 may be an electronic device including a display,such as a mobile phone, music player, tablet, laptop computing device,wearable electronic device, data storage device, display device, adapterdevice, desktop computer, or other electronic device.

Electronic device housing 110 may be a bucket-type enclosure havingfirst, second, third, and fourth side portions 111, 112, 113, 114 thatdefine outer sidewalls of electronic device 100, and a major planar face115 integrally attached with side portions 111, 112, 113, 114. Abucket-type enclosure allows components of electronic device 100 to beaccommodated within housing 110 and enclosed by an outer cover, such asouter cover 141. In other embodiments, one or more side portions 111,112, 113, 114, and/or back major planar face 115 may be formedseparately and subsequently joined together (e.g., with one or moreadhesives, welds, snap-fit connectors, fasteners, etc.) to formelectronic device housing 110. In various embodiments, electronic devicehousing 110 may be an H-beam type housing or other electronic devicehousing 110 that includes one or more walls that provide a housing to atleast partially support and/or enclose components of electronic device100.

Electronic device housing 110 is made from a material that providesadequate structural rigidity to support and protect internal componentsof electronic device 100. In some embodiments, electronic device housing110 is formed from a single piece of metal. Electronic device housing110 may be milled, molded, forged, etched, printed, or otherwise formed.Alternatively or additionally, electronic device housing 110 may beformed from plastic, glass, wood, carbon fiber, ceramic, combinationsthereof, and/or other materials.

Electronic device housing 110 and an outer cover 141 define an interiorvolume that can house various components of electronic device 110,including battery 120, circuit board 130, and display assembly 140.Electronic device housing 110 can accommodate additional components ofelectronic device 100, such as microphone 133, speaker 134, sensors 135,such as fingerprint sensors, proximity sensors, accelerometers, and/orother sensors, camera assembly 136, flash devices 137, processor 138,antennas, and/or other components. In various embodiments, some or allof these components may be electrically connected with circuit board130.

Display assembly 140 provides a user interface display that displaysinformation to a user. For example, display assembly 140 may provide atouch screen display that a user can interact with to view displayedinformation and to provide input to electronic device 100. In someembodiments, display assembly 140 occupies substantially all or themajority of a front major face 116 of electronic device 100 (e.g., andcovers battery 120 and first, second, and third circuit boards 130 a,130 b, 130 c), and includes a rectangular visible display.

Display assembly 140 includes one or more substrate layers that providethe visible display and/or allow display assembly 140 to receive touchinput from a user. For example, outer cover 141 may serve as anoutermost layer that encloses other components of display assembly 140and electronic device 100 and that a user may physically touch toprovide input to electronic device 100. In some embodiments, displayassembly 140 includes a liquid crystal display (LCD) panel 142 includinga liquid crystal material positioned between one or more color filterand thin-film-transistor (TFT) layers. The layers of display panel 142may include substrates formed from glass or polymer, such as polyamide.In various embodiments, display assembly 140 may be a light-emittingdiode (LED) display, an organic light-emitting diode (OLED) display,such as an active-matrix organic light-emitting diode (AMOLED) display,a plasma display, an electronic ink display, or other display thatprovides visual output to a user.

Display assembly 140 includes driver circuitry used to control displayoutput and/or receive user input. In some embodiments, driver circuitryincludes a display integrated circuit 145 that is mounted in electricalcommunication with the TFT layers of display panel 142, for example bygate lines or other electrical connection. Display integrated circuit145 may receive display data from processor 138, for example, anddeliver corresponding signals to control the optical properties of aliquid crystal layer, for example, to produce a visible output.

Connection between display integrated circuit 145 and circuit board 130(and processor 138, for example) may be provided by an electricalconductor that facilitates a robust electrical connection whilemaintaining a low profile configuration that does not significantlyincrease the overall dimensions of electronic device 100. In someembodiments, a flex conductor 150 connects display integrated circuit145 and circuit board 130. Flex conductor 150 includes conductivestructures on a thin, flexible substrate. Flex conductor 150 has arelatively thin profile and may be bent along a longitudinal directionto fit between various components of electronic device 100, such as toconnect from a front face of a display substrate to circuit board 130 bypassing between battery 120 and a rear of display assembly 140. Flexconductor 150 may be connected between first circuit board 130 a (e.g.,a top circuit board) or second circuit board 130 b (e.g., a bottomcircuit board). Alternatively or additionally, further electricalcommunication between display assembly 140 and the other of firstcircuit board 130 a or second circuit board 130 b is provided via thirdcircuit board 130 c.

Components of display assembly 140 and flex conductor 150 may bepositioned within electronic device 100 such that the space required toconnect display assembly 140 with circuit board 130 is reduced. In someembodiments, display integrated circuit 145 may be positioned at abottom of display substrate 142 (e.g., a portion of display substrate142 close to bottom wall 113) and flex conductor 150 wraps around a backside of display substrate 142 to connect with first and/or secondcircuit boards 130 a, 130 b. In some embodiments, display integratedcircuit 145 may be positioned at a top of display substrate 142 (e.g., aportion of display substrate 142 close to top wall 111) and flexconductor 150 wraps around a back side of display substrate 142 toconnect with first and/or second circuit boards 130 a, 130 b. In someembodiments, display integrated circuit 145 may be positioned along aside of display substrate 142 (e.g., a side portion of display substrate142 close to sidewall 112 or sidewall 114) and flex conductor wrapsaround a back side of display substrate 142 to connect with first and/orsecond circuit boards 1301, 130 b. In some embodiments, displayintegrated circuit 145 and flex conductor 150 are positioned so thatflex conductor 150 does not extend between display assembly 140 andbattery 120. Positioning the battery 120 directly adjacent displayassembly 140 (e.g., without an intervening electrical conductor 150passing between battery 120 and display assembly 140) facilitates anincreased battery size having a greater power capacity.

Conductive structures of flex conductor 150 may include conductivelines, printed conductive traces, or other conductive components thatprovide electrical connection between respective electrical contactsassociated with display integrated circuit 145 and circuit board 130.Flex conductor 150 may be a single, double, or multi-layer flexibleprinted circuit including a polyamide, PEEK, polyester, having printedor laminated conductive elements, for example. Such constructionprovides robust electrical characteristics that can provide reliableconnection between various components while having a low bending radiusto facilitate compact arrangement of flex conductor 150 withinelectronic device 100.

Battery 120 is positioned within electronic device housing 110. In someembodiments, battery 120 is positioned substantially centrally and/ortowards a bottom region of electronic device housing 110 that maypromote a user's perception of stability when electronic device 100 ishandled. For example, battery 120 may be positioned adjacent to first,second, and/or third circuit boards 130 a, 130 b, 130 c such thatbattery 120 is positioned substantially centrally between top and bottomsidewalls 111, 113. In other embodiments, battery 120 may be positionedin a stacked configuration such that circuit boards 130 a and/or 130 bare between battery 120 and display assembly 140 (e.g., sandwichedbetween battery 120 and display assembly 140), or vice versa.

Battery 120 provides a primary source of power for electronic device 100and its components. Battery 120 may include a secondary cell,rechargeable battery configured for use through thousands of batterycharging cycles over the entire useful life of electronic device 100,for example. In various embodiments, battery 120 may be a lithiumpolymer battery, lithium ion battery, nickel metal hydride battery,nickel cadmium battery, or other battery type configured to powerelectronic device 100 over many charging cycles. Alternatively oradditionally, battery 120 may include a primary cell battery configuredto be replaced when substantially discharged.

Battery 120 is shaped to provide a desired power capacity in aspace-efficient configuration. In some embodiments, battery 120 hasfront and back major planar faces 121, 122 separated by minor sides 123,124, 125, 126 defining a thickness (t_(thickness)) of battery 120. Forexample, sides 123, 125, may be parallel to top and bottom sidewalls111, 113 of electronic device housing 110, and extend substantiallyacross a width of electronic device housing 110, such as more than 50%,more than 75%, or more than 90% of the width of electronic devicehousing. Such a configuration promotes a relatively high power capacityfor a battery having a particular power density.

Circuit board 130 is configured to accommodate components of electronicdevice 100 in a space-efficient manner, and provide robust mechanicaland electrical connections between these components. Circuit board 130may support and/or electrically connect one or more components ofelectronic device 100 such as one or more of battery 120, microphone133, speaker 134, sensors 135, camera assembly 136, flash devices 137,processor 138, electrical connectors (e.g., USB connectors, audioconnectors, etc.), antenna lines, and/or other components. In someembodiments, circuit board 130 includes first circuit board 130 apositioned at a top region of electronic device housing 110, secondcircuit board 130 b positioned at a bottom region of electronic devicehousing 110. Third circuit board 130 c connects the first and secondcircuit boards 130 a, 130 b. First, second, and third, circuit boards130 a, 130 b may be separately formed circuit boards and may beelectrically connected by an electrical conductor. In other embodiments,first and second circuit boards 130 a, 130 b are integral (e.g.integrally formed as a unitary circuit board) with third circuit board130 c extending between first and second circuit boards 130 a, 130 b.First, second, and/or third circuit boards 130 a, 130 b, 130 c may beprinted circuit boards, flexible circuit boards, other circuit boardtypes, and/or combinations thereof.

First and second circuit boards 130 a, 130 b may be positioned at topand bottom positions of electronic device housing 110 so that variouscomponents may be accommodated at top and bottom regions of theelectronic device. For example, first circuit board 130 a is positionedat a top region of electronic device housing 110 and may includecomponents beneficially positioned at the top region. First circuitboard 130 a may accommodate components such as an earpiece assemblyincluding a speaker, front facing camera, proximity sensor, antennalines, a microphone configured to receive audio from the externalenvironment that may be processed to provide noise cancellation, cameraflash, diversity antenna, and/or other components. Second circuit board130 is positioned at a bottom region of electronic device housing 110and may include components beneficially positioned at the bottom region.Second circuit board may accommodate components such as an electricalconnector (e.g., USB connectors, audio connectors, etc.), audio speaker,microphone to receive audio input from a user or the externalenvironment, vibrator, and/or other components. Such positioning maypromote functionality and usability of the components by a user ofelectronic device 100.

Third circuit board 130 c may accommodate one or more other electricalcomponents and/or electrically connect various components of first andsecond boards 130 a, 130 b. In some embodiments, third circuit board 130c includes one or more of a hall effects sensor, battery thermistor,magnetometer, or other electronic components. Third circuit board 130 cmay electrically connect processor 138, on first circuit board 130 a,for example, with the components of second circuit board 130 b. In someembodiments, circuit board 130 c provides the only electrical connectionbetween first and second circuit boards 130 a, 130 b. Electronic device100 may not include a flex conductor, for example, extending overbattery 120 between first and second circuit boards 130 a, 130 b, andmay not include a flex conductor extending over battery 120 (e.g.,between battery 120 and display assembly 140) at all.

Third circuit board 130 c has a vertical orientation (e.g.,substantially vertical within 10° of exactly vertical) such that thirdcircuit board 130 c is oriented perpendicular to first and secondcircuit boards 130 a, 130 b. First and second circuit boards 130 a, 130b have major faces that are arranged perpendicular with back majorplanar face 115 of electronic device housing 110. Third circuit board130 c is oriented perpendicular to the back major planar face 115.Orienting third circuit board 130 c perpendicular to the back majorplanar face 155 reduces the dimensions that third circuit board 130 coccupies in an x-direction (e.g., across the width if the electronicdevice). For example, the major faces of third circuit board 130 c areoriented parallel to sidewalls 112, 114 of electronic device housing 110while the major faces of first and second circuit boards 130 a, 130 bare oriented parallel to the back major planar face 115 of electronicdevice housing 110.

Additional space is available within electronic device 110, particularlyin an x-direction, as a result of orienting third circuit board 130 c ina vertical orientation and may be used to accommodate other componentswithin electronic device housing 110. For example, electronic devicehousing 110 may accommodate a relatively large battery 120 as a resultof vertically-orienting third circuit board 130 c. In some embodiments,battery 120 occupies substantially an entire space between first andsecond circuit boards 130 a, 130 b, and between sidewall 112 andvertically-oriented third circuit board 130 c. Battery 120 may alsooccupy an entire space between back major planar face 115 of electronicdevice housing 110 and a rear-most portion of display assembly 140. As aresult, battery 120 can have a relatively larger volume and powercapacity such that electronic device 100 can operate for a longer periodof time between charges.

Third circuit board 130 c may include one or more user inputs, such as abutton or switch, that may be operated by user input along sidewall 114of electronic device housing 110. For example, a user-actuatable buttonmay be mounted on a major face of third circuit board 130 c orientedvertically (e.g., perpendicular to major faces of first and secondcircuit boards 130 a, 130 b). A user may actuate the button by pressinginwards along sidewall 114 of electronic device 110 such that the axisof actuation is perpendicular to the major face of third circuit board130 c. Such a configuration can promote a robust electrical connectionthat can be reliably actuated through thousands of cycles withoutfailure. Actuating in the direction of the circuit board can reduce theactuation force that could be placed on electrical connections betweenthe button and third circuit board 130 c, for example.

The material type, thickness, and number of layers of circuit board 130may be selected to provide desired properties. For example, thesubstrate layers and electrical trace layers of first, second and thirdcircuit boards 130 a, 130 b, 130 c can be selected to affect themechanical stiffness, insulating characteristics, and electricalimpedance, for example, of the boards. In various embodiments, first,second, and/or third circuit boards 130 a, 130 b, 130 c includesubstrate layers made from FR-2 phenolic paper, FR-3 cotton paper, FR-4epoxy resin-impregnated woven fiberglass, metal core board,polytetrafluoroethylene, polyimide, polyamide, combinations thereof,and/or other materials. The materials and characteristics of one or moreconductive layers, such as conductive traces, can be selected based onmechanical and/or electrical properties. For example, the material andthickness of a conductive trace layer may be selected to provide adesired electrical impedance.

In some embodiments, the material layers and characteristics of first,second, and third circuit boards 130 a, 130 b, 130 c may differ fromeach other, and may be individually selected based on the configurationof electronic components of first, second, and third circuit boards 130a, 130 b, 130 c. For example, characteristics of third circuit board 130c may be selected independent of characteristics of first and/or secondcircuit boards 130 a, 130 b. Independent design and configuration offirst, second, and/or third circuit boards 130 a, 130 b, 130 c may befacilitated by forming the boards separately and subsequently connectingthe boards (e.g., during manufacturing of electronic device 100). Insome embodiments, third circuit board 130 c is relatively thinner (e.g.,has fewer substrate and conductive layers), than first and/or secondcircuit boards 130 a, 130 b, and/or includes conductive traces havingthicknesses and resistances that differ from conductive traces of firstand second circuit boards 130 a, 130 b. Separately formed and assembledfirst, second, third circuit boards 130 a, 130 b, 130 c, can thusfurther reduce the overall space required by circuit board 130, and maypromote flexibility in accommodating other components within electronicdevice housing 110.

First, second, and third circuit boards 130 a, 130 b, 130 c, are sizedto fit within electronic device 100 and accommodate the desiredelectronic components. In some embodiments, the first, second, and thirdcircuit boards have different sizes (e.g., different usable surfaceareas). First circuit board 130 a is larger than second and third boards130 b, 130 c, and second circuit board 130 b is larger than thirdcircuit board 130 c.

Referring to FIG. 2, first and second circuit boards 130 a, 130 b, arefixedly positioned within electronic device housing 110 and separated bya distance (d). Third circuit board 130 c extends partially orcompletely between first and second circuit boards 130 a, 130 b. In someembodiments, third circuit board 130 c extends between first and secondcircuit boards 130 a, 130 b and spans distance (d). For example, thirdcircuit board 130 c has a length (l_(board)) between first and secondopposite end regions 171, 172. Length (l_(board)) may be at leastsubstantially equal to distance (d) such that third circuit board canspan distance (d) and provides electrical connection between first andsecond circuit boards 130 a, 130 b. In some embodiments, length(l_(board)) is greater than distance (d). For example, third circuitboard 130 c may be described as extending along or overlapping withportions of first and/or second circuit boards 130 a, 130 b (e.g., tofacilitate electrical connection). Third circuit board 130 c may besubstantially planar along the entire distance (d) between first andsecond circuit boards 130 a, 130 b. In other embodiments, third circuitboard 130 c may include one or more bends or curves (e.g., toaccommodate other electrical components or to facilitate connection withfirst and second circuit boards 130 a, 130 b) along distance (d) betweenfirst and second circuit boards 130 a, 130 b.

Distance (d) between first and second circuit boards 130 a, 130 b, mayprovide a space in which battery 120 is accommodated. Battery 120 has alength (l_(battery)) between minor sides 123, 125, (e.g., sides orientedparallel to top and bottom sidewalls 111, 113 of electronic devicehousing 110), and a width (w_(battery)) between minor sides 124, 126(e.g., sides oriented substantially parallel to side portions 112, 114).In some embodiments, length (l_(battery)) is equal to distance (d) suchthat battery 120 occupies substantially the entire distance betweenfirst and second circuit boards 130 a, 130 b. Alternatively oradditionally, there may be no electrical components between battery 120(e.g., sidewalls of battery 120) and first, second, and/or third circuitboards 130 a, 130 b, 130 c, respectively. Such a configuration allowsbattery 120 to accommodate a maximum distance between first and secondboards 130 a, 130 b to improve the power capacity of battery 120.Alternatively or additionally, distance (d) may be greater than 50% oflength (L_(housing)) of electronic device housing 110. Such relativedimensions provide a space for battery 120 that accounts for asignificant portion of the interior volume of electronic device 100.Battery 120 may thus be relatively large and provide a relatively highpower capacity and facilitate an extended period of time betweencharges.

Little or no space may exist between sidewalls of battery 120 and first,second, and/or third circuit board 130 a, 130 b, 130 c. For example, adistance between sidewall 126 of battery 120 and third circuit board 130c may be less than 2.0 mm, less than 1.0 mm, less than 0.5 mm, less than0.2 mm, or 0 (e.g., such that battery 120 is in contact with thirdcircuit board 130 a, 130 b, 130 c). Alternatively or in addition, adistance between sidewall 123 of battery 120 and first circuit board 130a may be less than 2.0 mm, less than 1.0 mm, less than 0.5 mm, less than0.2 mm, or 0 mm, and a distance between sidewall 125 of battery 120 andsecond circuit board 130 b may be less than 2.0 mm, less than 1.0 mm,less than 0.5 mm, less than 0.2 mm, or 0 mm. In some embodiments, adistance between sidewall 123 and first circuit board 130 a is less than1.0 mm, a distance between sidewall 125 and second circuit board 130 bis less than 1.0 mm, and a distance between sidewall 126 and thirdcircuit board 130 c is less than 0.5 mm.

Distance (d) may provide a space within electronic device housing inwhich no electronic components are accommodated except battery 120. Insome embodiments, only battery 120, and no other electrical components,are accommodated in a space surrounded by first, second, and thirdcircuit boards 130 a, 130 b, 130 c.

Electronic device housing 110 has a width (W_(housing)) between walls112, 114 and a length (L_(housing)) between walls 111, 113. In someembodiments, width (W_(housing)) between walls 112, 114 is entirelyoccupied by battery 120 and third circuit board 130 c at locations wherebattery 120 is present. For example, width (w_(battery)) may be slightlysmaller than width (W_(housing)) such that third circuit board 130 c canbe accommodated between battery 120 and wall 114, for example. Therelative sizes of electronic device housing 110, battery 120, and thirdcircuit board 130 c may allow third circuit board 130 c to fit betweenbattery 120 and wall 114 in a particular orientation (e.g., anorientation in which third circuit board 130 c is parallel to batteryside 126 and wall 114, or perpendicular to first and/or second circuitboards 130 a, 130 b.). In various embodiments, width (w_(battery)) isgreater than 80%, greater than 85%, greater than 90%, greater than 95%,or greater than 98% of width (W_(housing)) of electronic device housing110 between inner surfaces of walls 112, 114. Such relative dimensionscan facilitate a battery 120 having a relatively large width(w_(battery)) while third circuit board 130 c is oriented in asubstantially vertical orientation between a minor battery side defininga thickness of battery 120 and wall 114 of electronic device housing110.

First and second circuit boards 130 a, 130 b may extend acrosssubstantially the entire width (W_(housing)) of electronic devicehousing 110. Alternatively, first and second circuit boards 130 a, 130b, and third circuit board 130 c extend across substantially the entirewidth (W_(housing)) (e.g., in configurations in which third circuitboard has a length (l_(board)) greater than a distance (d) between firstand second circuit boards 130 a, 130 b). Circuit board 130 extends alongsubstantially the entire length (L_(housing)) of electronic devicehousing 110. For example, first, second, and third boards 130 a, 130 b,130 c may together extend along substantially the entire length(L_(housing)) of electronic device housing 110.

Referring to FIG. 3, a cross-sectional perspective view of an exampleelectronic device 100 is shown, in which third circuit board 130 c ispositioned between an outer sidewall 114 of electronic device housing110 and battery 120. Third circuit board 130 c is oriented substantiallyvertically. For example, major surfaces of third circuit board 130 c areoriented substantially parallel to outer sidewall 114 and battery side124 such that third circuit board 130 c extends along a thickness(t_(battery)) of battery 120, and may directly contact outer sidewall114 and/or battery side 124 at particular locations (e.g., third circuitboard may be substantially flush against outer sidewall 114 and/orbattery side 124). A distance between battery 120 and electronic devicehousing 110 defines a gap having a width (w_(gap)). The width of the gap(w_(gap)) is sufficiently large to accommodate third circuit board 130c. In some embodiments, third circuit board 130 c only fits within thegap in a substantially vertical orientation. For example, the width(w_(board)) is greater than the width of the gap (w_(gap)) such thatthird circuit board 130 c would not fit between battery 120 and housing110 if rotated to a substantially horizontal orientation, for example.

Electronic device housing 110 includes one or more engagement featuresthat interact with display assembly 140. For example, electronic devicehousing 110 may include a ledge or shoulder 117 that display assembly140 engages with. Display assembly 140 may be sealingly joined withelectronic device housing 110 at shoulder 117 to enclose componentswithin electronic device housing 110 and to prevent ingress ofenvironmental contaminants such as water, dust, debris, and otherforeign matter. In some embodiments, display assembly 140 includes aseal that interacts with a display panel 142 of display assembly 140 anda feature of electronic device housing 110. For example, seal mayfacilitate sealing engagement between shoulder 117 and an inner surfaceof display panel 142. Shoulder 117 may be integral to electronic devicehousing 110.

Third circuit board 130 c is positionable within electronic devicehousing 110 below shoulder 117. For example, third circuit board 130 cmay be positionable entirely below shoulder 117 so that display assembly140 can be at least partially supported by shoulder 117 above thirdcircuit board 130 c. The surface defined by the thickness (t_(board)) ofthird circuit board 130 c is arranged parallel and/or substantiallyadjacent to shoulder 117. In some embodiments, the width (w_(shoulder))of shoulder 117 is greater than the thickness (t_(board)) of thirdcircuit board 130 c, and/or third circuit board 130 c may be at leastpartially nested below shoulder 117 (e.g., within a recess of wall 114below shoulder 117). Such a configuration may provide a space-efficientconfiguration of third circuit board 130 c that facilitates a relativelylarge battery 120.

The thickness (t_(board)) of third circuit board 130 c may be less thanthe thickness (t_(battery)) of battery 120. In various embodiments,thickness (t_(board)) is between about 10% and 80%, 15% and 60%, orabout 25% of thickness (battery) of battery 120.

Referring to FIG. 4, an example circuit board 430 of an electronicdevice 400 is shown, including first, second and third circuit boards430 a, 430 b, and 430 c. In various embodiments, electronic device 400and circuit board 430 may have features similar to electronic device 100and circuit board 130, described herein. Circuit board 430 ispositionable within an electronic device housing together with othercomponents of electronic device 400.

First, second, and third circuit boards 430 a, 430 b, 430 c, areseparately formed and connected during a manufacturing operation. Forexample, third circuit board 430 c may be connected with first andsecond circuit boards 430 a, 430 b such that at least a portion of thirdcircuit board 430 c between first and second circuit boards 430 a, 430 bis oriented substantially perpendicularly to first and second circuitboards 430 a, 430 b.

Third circuit board 430 a includes first and second opposite end regions471, 472 having first and second connectors 473, 474, respectively.First and second connectors are configured to connect with complementaryconnectors 439 a, 439 b of first and second circuit boards 430 a, 430 b.First and second connectors 473, 474 and complementary connectors 439 a,439 b provide a secure electrical connection, and may include aboard-to-board connector, zero insertion force (ZIF) connector,micro-coaxial connector, combinations thereof, and/or other connectorsthat provide a secure electrical connection.

First and second opposite end regions 471, 472 are configured such thatthird circuit board 430 c may be positioned to connect betweencomplementary connectors 473, 474 of first and second boards 430 a, 430b. In some embodiments, first and second end regions 471, 472 includearm portions 475 that extend from a middle region 476. Arm portions mayextend upwards and inwards, for example, including multiple bends (e.g.,such as approximately 90° bends) so that first and second connectors473, 474 can engage complementary connectors 439 a, 439 b.

In some embodiments, third circuit board 430 c is configured to fitwithin the distance (d) separating first and second circuit boards 430a, 430 b. For example, third circuit board has a length (l_(board)) thatis long enough to connect the first and second circuit boards while alength of a vertically-oriented portion is less than or substantiallyequal to distance (d). First and second end regions 471, 472 extend overthe top of first and second boards 430 a, 430 b, and/or a batterypositioned between first and second boards 430 a, 430 b, from innersides 481, 482, respectively, of first and second circuit boards 430 a,430 b (e.g., sides separated by distance (d)). In this way, each offirst, second, and third circuit boards 430 a, 430 b, 430 c, may extendsubstantially to a side wall of a housing of electronic device 400(e.g., each of first, second, and third circuit boards 430 a, 430 b, 430c, may be substantially flush with a housing sidewall along theirlength).

First and second end regions 471, 472 may be flexible such that firstand second end regions 471, 472 can be bent into a desired position.Flexible end regions 471, 472 may facilitate positioning of first andsecond connectors 473, 474 for engagement with complementary connectors439 a, 439 b. For example, first and second ends may be folded and/ortwisted at one or more locations (e.g., folded upwards approximately 90°and folded inwards towards a complementary connector approximately 90°degrees) to align first and second connectors 473, 474 withcomplementary connectors 439 a, 439 b.

The material type and characteristics of the components of third circuitboard 430 c may be selected so that third circuit board 430 c has adesired flexibility. For example, third circuit board 430 c may havefewer or thinner substrate layers at locations of relatively higherflexibility, and have more or thicker substrate layers at locations ofrelatively lower flexibility. Alternatively or additionally, thirdcircuit board 430 c may be formed of different substrate types in middleregion 476 and first and second end regions 471, 472. First and secondend regions may be a flexible circuit (e.g., a flex circuit having apolyamide substrate), and middle region 476 may be formed of arelatively stiffer substrate. Accordingly, third circuit board 430 c mayhave a variable stiffness that differs over the length of third circuitboard 430 c. A variable stiffness over the length of third circuit board430 c may facilitate connection with first and second circuit boards 430a, 430 b, while providing a robust and durable circuit board.

In the example embodiment shown in FIG. 4, first and second connectors473, 474 and complementary connectors 439 a, 439 b are orientedvertically such that third circuit board 430 c may be connected throughengagement in a vertical direction. For example, third circuit board 430c may be connected to first and second circuit boards 430 a, 430 b bylowering third circuit board 430 c into engagement with first and secondcircuit boards.

The direction of engagement between third circuit board 430 c, and firstand second circuit boards 430 a, 430 b, may be selected to facilitateefficient manufacturing process and/or a sequence of manufacturing. Insome embodiments, vertical engagement may facilitate connection of thirdcircuit board 430 c after assembly of first and second circuit boards430 a, 430 b with other components of electronic device 400, such asafter first and second circuit boards 430 a, 430 b are positioned inelectronic device housing 110.

Referring to FIG. 5, an example circuit board 530 of an electronicdevice 500 is shown, including first, second and third circuit boards530 a, 530 b, and 530 c. In various embodiments, electronic device 500and circuit board 530 may have features similar to electronic device 100and circuit board 130, described herein. Circuit board 530 ispositionable within an electronic device housing together with othercomponents of electronic device 500.

First, second, and third circuit boards 530 a, 530 b, 530 c, areseparately formed and connected during a manufacturing operation. Forexample, third circuit board 530 c may be connected with first andsecond circuit boards 530 a, 530 b such that at least a portion of thirdcircuit board 430 c between first and second circuit boards 530 a, 530 bis oriented substantially perpendicularly to first and second circuitboards 530 a, 530 b.

Third circuit board 530 a includes first and second opposite end regions571, 572 having first and second connectors 573, 574, respectively,configured to connect with complementary connectors 539 a, 539 b offirst and second circuit boards 530 a, 530 b. First and secondconnectors 573, 574 and complementary connectors 539 a, 539 b provide asecure electrical connection, and may include a board-to-boardconnector, zero insertion force (ZIF) connector, micro-coaxialconnector, combinations thereof, and/or other connectors that provide asecure electrical connection.

Third circuit board 530 c has a length (l_(board)) that is greater thana distance (d) separating first and second circuit boards 530 a, 530 b.For example, a vertically-oriented portion of third circuit board 530 cat least partially overlaps with first and/or second boards 530 a, 530 b(e.g., third circuit board 530 c is between a wall of a housing ofelectronic device 500 and edges of first and/or second circuit boards530 a 530 b). First and second end regions 571, 572 extend over the topof first and second boards 530 a, 530 b, and/or a battery positionedbetween first and second boards 530 a, 530 b, from outer sides 581, 582,respectively. In this way, a relatively large space between first,second, and third circuit boards 530 a, 530 b, 530 c, is provided toaccommodate a relatively large battery.

In the example embodiment shown in FIG. 5, first and second connectors573, 574 and complementary connectors 539 a, 539 b are orientedhorizontally such that third circuit board 530 c may be connectedthrough engagement in a horizontal direction. For example, third circuitboard 530 c may be connected to first and second circuit boards 530 a,530 b by bringing circuit board 530 c into engagement with first andsecond circuit boards 530 a, 530 b in a horizontal direction. In someembodiments, horizontal engagement may facilitate connection of thirdcircuit board 530 c with first and second circuit boards 530 a, 530 b,and connection of circuit board 500 as a unit with other components ofelectronic device 500.

Referring, to FIG. 6, an example connector 600 is shown that can be usedto connect circuit boards, such as third circuit board 130 c, 430 c, 530c, with first and second circuit boards, such as first and secondcircuit boards 130 a, 130 b, 430 a, 430 b, 530 a, 530 c. Connector 600includes a central connector 610 and side connectors 620, 630 spaced oneach side of central connector 610 such that central connector 610 andside connectors 620, 630 are arranged in a row. In some embodiments,central connector 610 includes a board-to-board type connector and sideconnectors 620, 630 include micro-coax connectors. The board-to-boardconnector provides reliable and compact electrical connection. Themicro-coax connector can serve to as retention pins, providingadditional mechanical robustness to the connection.

Referring to FIG. 7, a flow diagram of an example method 700 ofmanufacturing an electronic device is shown. In some embodiments, method700 includes operation 702 of connecting first and second circuit boards(e.g., circuit boards arranged at top and bottom regions of theelectronic device) with a third circuit board. For example, the thirdcircuit board may be connected with the first and second circuit boardsin a vertical orientation such that major faces of the third circuitboard are oriented substantially perpendicular to major faces of thefirst and second circuit boards. The first, second and third circuitboards may be joined using one or more board-to-board connectors, zeroinsertion force connectors, micro-coax connectors, other connectors,and/or combinations thereof. In some embodiments, first and secondcircuit boards are connected to third circuit board by a board-to-boardconnector and two micro-coax connectors positioned on opposite sides ofthe board-to-board connector.

Method 700 further includes operation 704 of securing the circuit boardin the electronic device housing. For example, the circuit board may bebrought into engagement with one or more complementary features of theelectronic device housing and fixed into position relative to theelectronic device housing. The circuit board may be secured using one ormore snap-fit connectors, adhesives, welds, or other fasteningtechniques.

Method 700 further includes operation 706 of positioning a battery in aspace defined by the first, second, and third circuit boards. Forexample, first, second, and third circuit boards may define three sidesof a substantially rectangular space that a battery may be accommodatedin. In some embodiments, the battery is positioned to fill substantiallythe entire space between first and second circuit boards, and between awall of the electronic device housing and the third circuit board.

Operations 702, 704, and 706 may be performed in any suitable order. Insome embodiments, first, second, and third circuit boards, are connectedin an initial manufacturing step before being assembled with the housingand the battery. In other embodiments, first, second, and/or thirdcircuit boards may be individual secured with the electronic devicehousing. The first and second circuit boards may be fastened with theelectronic device housing in an initial step, and the third circuitboard may subsequently be connected with the first and second circuitboards. In some embodiments, the third printed circuit board may beinstalled within the electronic device housing before the first andsecond circuit boards. The first and second boards may then be connectedwith the third circuit board, followed by positioning of a battery andconnection of the battery to a circuit board.

While this specification contains many specific implementation details,these should not be construed as limitations on the scope of thedisclosed technology or of what may be claimed, but rather asdescriptions of features that may be specific to particular embodimentsof particular disclosed technologies. Certain features that aredescribed in this specification in the context of separate embodimentscan also be implemented in combination in a single embodiment in part orin whole. Conversely, various features that are described in the contextof a single embodiment can also be implemented in multiple embodimentsseparately or in any suitable subcombination. Moreover, althoughfeatures may be described herein as acting in certain combinationsand/or initially claimed as such, one or more features from a claimedcombination can in some cases be excised from the combination, and theclaimed combination may be directed to a subcombination or variation ofa subcombination. Similarly, while operations may be described in aparticular order, this should not be understood as requiring that suchoperations be performed in the particular order or in sequential order,or that all operations be performed, to achieve desirable results.Particular embodiments of the subject matter have been described. Otherembodiments are within the scope of the following claims.

What is claimed is:
 1. An electronic device, comprising: an electronicdevice housing having a major planar face and first and second outersidewalls extending perpendicular from the major planar face, theelectronic device having a width between the first outer sidewall andthe second outer sidewall of the electronic device housing; a firstcircuit board and a second circuit board, the first circuit board andthe second circuit board each oriented parallel to the major planarface; a third circuit board electrically connected with the firstcircuit board and the second circuit board, at least a portion of thethird circuit board oriented both perpendicular to the major planar faceand between the first circuit board and the second circuit board; and abattery at least partially surrounded by the first circuit board, thesecond circuit board, and the third circuit board on at least threesides, wherein the first circuit board, the second circuit board, andthe third circuit board together extend along an entire length of theelectronic device housing, and the first circuit board and the secondcircuit board each extend across an entire width of the electronicdevice housing; and wherein the at least a portion of the third circuitboard oriented perpendicular to the major planar face is also orientedparallel to the first and second outer sidewalls.
 2. The electronicdevice of claim 1, wherein the third circuit board is integral to thefirst circuit board as a unitary circuit board.
 3. The electronic deviceof claim 2, wherein the first circuit board, the second circuit board,and the third circuit board are integrally formed as a unitary circuitboard.
 4. The electronic device of claim 1, wherein the third circuitboard is a printed circuit board.
 5. The electronic device of claim 1,wherein the third circuit board is a flexible circuit.
 6. The electronicdevice of claim 1, wherein the first circuit board and the secondcircuit board are each fixedly positioned with respect to the electronicdevice housing and separated by a distance (d).
 7. The electronic deviceof claim 6, wherein the third circuit board is oriented vertically overthe entire distance (d).
 8. The electronic device of claim 6, whereinthe third circuit board is oriented vertically over at least half of thedistance (d).
 9. The electronic device of claim 6, wherein the thirdcircuit board has a length (board) that is greater than the distance(d).
 10. The electronic device of claim 8, wherein the battery has firstand second major faces separated by sidewalls, and the first major faceand the second major face are oriented parallel to the first circuitboard and the second circuit board.
 11. The electronic device of claim1, wherein the electronic device housing includes first, second, third,and fourth outer sidewalls extending perpendicular from the major planarface, the electronic device having a length (L_(housing)) between thefirst outer sidewall and the second outer sidewall of the electronicdevice housing.
 12. The electronic device of claim 11, wherein adistance between the first and second circuit boards is greater than0.5*length (L_(housing)) of the electronic device housing.
 13. Theelectronic device of claim 1, wherein the third circuit board has astiffness that is relatively greater in a middle region and relativelylower at opposite end regions.
 14. The electronic device of claim 1,wherein the third circuit board includes first and second connectors atopposite end regions connected to respective connectors of the firstcircuit board and the second circuit board.
 15. The electronic device ofclaim 14, wherein the first and second connectors each include at leastone board-to-board connector and at least one micro-coaxial connector.16. An electronic device, comprising: an electronic device housinghaving a major planar face and first and second outer sidewallsextending perpendicular from the major planar face, the electronicdevice having a width between the first outer sidewall and the secondouter sidewall of the electronic device housing; a first printed circuitboard oriented parallel to the major planar face, the first printedcircuit board including a speaker, front facing camera, proximitysensor, microphone, and camera flash; a second printed circuit boardoriented parallel to the major planar face and separated from the firstprinted circuit board by a distance, the second printed circuit boardincluding an electrical connector, an audio connector, a microphone, anda vibrator; a third printed circuit board electrically connected withthe first and second circuit boards, at least a portion of the thirdcircuit board oriented both perpendicular to the major planar face andbetween the first and second circuit boards; and a battery a leastpartially surrounded by the first circuit board, the second circuitboard, and the third circuit board on at least three sides; wherein thefirst circuit board, the second circuit board, and the third circuitboard together extend along an entire length (L_(housing)) of theelectronic device housing, and the first circuit board and the secondcircuit board each extend across an entire width (W_(housing)) of theelectronic device housing; and wherein the at least a portion of thethird circuit board oriented perpendicular to the major planar face isalso oriented parallel to the first and second outer sidewalls.
 17. Theelectronic device of claim 16, wherein the third circuit board isoriented perpendicular to the major planar face over the entiredistance.
 18. The electronic device of claim 17, wherein the distancebetween the first and second circuit boards is greater than 0.5*length(L_(housing)) of the electronic device housing.
 19. A method ofmanufacturing an electronic device, comprising: connecting a firstcircuit board and a second circuit board with a third circuit board, thethird circuit board having major faces perpendicular to major faces ofthe first and second circuit boards; securing the first circuit board,the second circuit board, and the third circuit board to an electronicdevice housing; the electronic device having a major planar face andfirst and second outer sidewalls extending perpendicular from the majorplanar face, the electronic device having a width between the firstouter sidewall and the second outer sidewall of the electronic devicehousing; positioning a battery in a space within the electronic devicehousing defined by the first circuit board, the second circuit board,and the third circuit board; and wherein the major faces of the thirdcircuit board oriented perpendicular to the major faces of the first andsecond circuit boards is also oriented parallel to the first and secondouter sidewalls.
 20. The method of claim 19, wherein the connecting stepcomprises connecting at least one board-to-board connector and at leastone micro-coaxial connector.